CS-FLUX 5g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
10,99 €
Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for visual alignment. Supports BGA rework when needed, while excelling in everyday SMD microsoldering—connectors, QFN/DFN, jumpers, and fine-pitch pads—with precise, low-pressure dosing.
Turns clear under heat so you can solder by sight.
CS FLUX 5g is a halogen-free, lead-free, no-clean (meaning that any remaining CS-FLUX will not be corrosive to the PCB and does not need to be cleaned) flux formulated for modern board repair where control and visibility matter. At room temperature it behaves as a soft gel for accurate placement. Under heat it becomes highly fluid, spreads uniformly, and turns transparent so you can track wetting and alignment under a microscope. It supports BGA rework and reballing when the job requires it, but its real strength is in routine microsoldering: replacing USB-C and HDMI ports, reattaching fine-pitch SMD controllers, drag soldering pin headers, laying jumper wires over interrupted traces, and refreshing oxidized pads on compact logic boards. CS-FLUX is formulated as a soft gel at room temperature, making it easy to dispense directly from the applicator tube without special tools. The user can apply the exact quantity needed with simple finger pressure, ensuring precision and control in every application. In contrast, many other fluxes are so thick that they require dedicated equipment such as pneumatic pumps to be squeezed out, making CS-FLUX a far more practical and user-friendly choice for both professionals and DIY users. The gel’s light tack helps hold small parts and solder balls in place before heating, while the low-residue chemistry keeps post work cleanup minimal. Even users with limited soldering experience can achieve cleaner, more repeatable joints that resemble the work of experienced technicians. Store sealed, away from heat and sunlight; for extended stability, keep in a cool, dry place.
Packet includes:
• 1 × 5 g applicator tube of CS-FLUX
• 1 × 1.6 mm precision application tip
Engineered in Greece, trusted across the EU.
• Turns transparent as it reaches working temperature, letting you see pads, fillets, and lead outlines clearly under the microscope so you can confirm wetting, detect bridges early, and guide the iron or hot air nozzle with confidence during delicate SMD work.
• Liquefies and wicks under parts during heating for uniform pad activation; ideal for reattaching fine-pitch ICs (QFN/DFN, SOIC, TQFP), refreshing oxidized pads, and stabilizing drag solder passes on dense connectors without drowning the area in excess flux.
• Soft, lightly tacky gel at room temperature helps “stage” components, jumpers, or stencil spheres before heat; once hot, viscosity drops dramatically to minimize part drift and promote even solder flow across arrays, headers, and shield frames.
• no-clean, halogen-free, lead-free formulation engineered for electronics repair; residue is thin and localized, and when inspection or conformal coating is planned it can be wiped with high purity isopropyl alcohol without aggressive scrubbing.
• Practical for DIY benches and professional stations alike: precise, low-pressure dosing from the included 1.6 mm tip means a tiny amount covers a large footprint, reducing mess, improving repeatability, and keeping neighboring components visible.
• Versatile across hot air, IR plate, and iron-only work flows: supports BGA rework when required, but shines in everyday repairs such as USB-C/HDMI/DC jack replacements, sensor and button boards, WiFi modules, and micro connector rows on compact devices.
Additional information
Weight
30 g
Q: What is CS FLUX and what makes it different from other fluxes?
A: CS FLUX is a halogen free, lead free, no clean soft gel flux formulated for electronics repair and microsoldering. At room temperature it behaves like a controllable gel; under heat it becomes very fluid and turns transparent so you can see pads and solder flow clearly. Unlike thick pastes that need pumps or heavy pressure, CS FLUX dispenses with light finger pressure directly from the applicator tube.
Q: Do I need a pump or pneumatic dispenser?
A: No. The soft gel body is tuned for low pressure, hand controlled dosing. Squeeze gently and it will place a precise micro drop where you need it—ideal for microscopes and tight clearances.
Q: How fine is the dosing—can I place a single tiny drop?
A: Yes. The included precision needle tip allows very small, repeatable drops. Because the gel is soft, it starts and stops cleanly without “stringing,” so you can wick just enough under a connector pad or QFN edge.
Q: What does “no clean” mean here? Do I ever need to clean it?
A: No clean means the residues are non corrosive and safe to leave in typical electronics repairs. If you need a cosmetically clean board, plan to apply conformal coating, or you simply prefer a spotless finish, wipe with high purity isopropyl alcohol after the joint cools.
Q: Will CS FLUX corrode copper, solder mask, or components over time?
A: No. It’s halogen free and formulated to avoid corrosive residues. It is designed for modern PCB finishes and components when used as directed.
Q: Is it suitable for beginners?
A: Yes. The transparency when hot, low effort dosing, and soft pre heat tack make it very forgiving. Many first time users report cleaner joints with fewer bridges on USB C/HDMI connectors, headers, and fine pitch ICs.
Q: Can I use it for BGA work as well as everyday SMD?
A: Yes. It supports BGA rework and reballing (wicking under the package during heat), but its biggest day to day advantage is on connectors, QFN/DFN, jumpers, and small modules.
Q: Does it smoke a lot?
A: CS FLUX is low fume compared to many rosin heavy formulas. You’ll still see some vapor as with any flux—work in a ventilated area or use a fume extractor for comfort.
Q: Is it electrically conductive?
A: No. CS FLUX is non conductive. Like any flux, avoid leaving excessive residue where insulation resistance is critical, and clean if your application requires it.
Q: Leaded or lead free solder—does it matter?
A: It works with both. The activation profile is designed for common repair alloys (SnPb and SAC).
Q: Can I use it with a soldering iron, hot air station, or IR plate?
A: Yes. It is compatible with iron only touch ups, hot air rework, and IR preheating/reflow setups.
Q: How much should I apply?
A: Less than you think. Start with a micro drop; as heat is applied the flux turns very fluid and spreads, activating the entire pad. Add more only if you see dull, stubborn wetting.
Q: Will parts slide around when I heat them?
A: The gel has a light tack at room temperature to help “stage” parts. As it liquefies, part drift is minimized by using just enough flux and maintaining even heat.
Q: Tips for USB C/HDMI/DC jack replacements?
A: Place a small line along the pad row, align, and heat evenly. The flux will wick under the footprint and turn clear so you can watch bridges form and collapse. After soldering, inspect and clean only if you want an appearance grade finish.
Q: Can it help with oxidized pads?
A: Yes. A small amount brushed across dull pads improves wetting before you tin or drag solder.
Q: How do I remove residues if I choose to clean?
A: After the board cools, wipe with high purity isopropyl alcohol and a lint free swab. For heavy areas, a brief soak and gentle brushing works well.
Q: Storage and longevity—what’s recommended?
A: Keep the cap on, store sealed in a cool, dry place, away from heat and sunlight. If it has been stored cold, let it return to room temperature before use for consistent viscosity.
Q: The gel seems thicker after storage—what should I do?
A: Allow it to warm to room temperature and knead the tube lightly before attaching the tip. Replace or rinse the tip if it has dried residues.
Q: Will it stain plastics or the solder mask?
A: Residues are usually thin and clear. Avoid prolonged soaking of porous plastics or elastomers; wipe any excess soon after work for best cosmetics.
Q: Can I use CS FLUX on large ground planes or heavy copper boards?
A: Yes, but preheating the board (hot plate or gentle hot air preheat) reduces thermal shock and improves flow on high mass areas.
Q: Is it safe around sensitive sensors or cameras on phones/tablets?
A: Use sparingly and shield optics from vapors while heating. The transparent behavior helps you keep flux away from lenses and membranes.
Q: Does it help with drag soldering pin headers and fine pitch ICs?
A: Absolutely. Place a micro bead along the pins and use a clean, tinned iron tip; the flux promotes even wetting so excess solder follows the tip instead of bridging.
Q: Can I reuse the precision tip?
A: Yes. Cap the tube between sessions. If the tip clogs, rinse with isopropyl alcohol, let dry, and reinstall. Keep a spare clean tip for microscope work.
Q: What quantities are available and what comes in the pack?
A: CS FLUX is available in single 5 g and 10 g tubes, dual 5 g (2×5 g), and triple 5 g (3×5 g) packs. Each tube includes a precision application tip. All packs are ready to use—no pump or extra hardware required.
Reviews
There are no reviews yet.
Only logged in customers who have purchased this product may leave a review.
Two part CPU/GPU service set for mixed interfaces: KRYO33 >13 W/m·K* on the die, K5-PRO >5.3 W/m·K* for pad replacement zones up to ~3 mm; non conductive, zero curing time, DIY friendly workflow.
Three-piece repair set for laptops, desktops and consoles: non conductive thermal putty (>5.3 W/m·K*), high performance thermal paste (>13 W/m·K*), and lead-free, halogen-free no-clean flux for precise SMD work.
Premium CPU/GPU compound with >13 W/m·K* conductivity and ultralow thermal resistance (<0.004 K/W); zero electrical conductivity; no curing time; engineered to spread thin, fill micro gaps and deliver durable, long term stability.
Three 5 g applicator tubes for busy benches and field work; liquefies under heat, turns clear for inspection. Everyday SMD tasks—connectors, jumpers, QFN/DFN, headers—and BGA rework support when required.
Two 5 g applicator tubes for flexible bench use; liquefies under heat and turns clear for visual alignment. Ideal for everyday SMD work—connectors, headers, QFN/DFN, jumpers—and supports BGA rework when needed.
Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for alignment and inspection. Everyday SMD tasks—ports, headers, jumpers, QFN/DFN—plus BGA rework when required; precise, low-pressure dosing from the included tip.
Reviews
There are no reviews yet.