Showing all 39 results
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Liquid Metal by CSGR 1g – 79 W/m·K* high performance thermal interface for CPU/GPU upgrades
THERMAL PASTES19,99 €Liquid Metal by CSGR 1g – 79 W/m·K* high performance thermal interface for CPU/GPU upgrades
Ultrahigh thermal conductivity compound for serious cooling projects; electrically conductive and designed for controlled application. Compatible with K5-PRO® thermal putty as a protective barrier to help prevent migration during long operation.
19,99 € -
Liquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
SET OF PRODUCTS & THERMAL PASTES26,99 €Liquid Metal by CSGR 1g & K5-PRO® 20g set – 79 W/m·K* liquid metal plus >5.3 W/m·K* thermal putty
High performance cooling bundle that pairs liquid metal for direct die CPU/GPU use with K5-PRO® non conductive putty to fill gaps and create a protective perimeter—safer installs, stronger thermal contact, cleaner results.
26,99 € -
PTM7950 by CSGR® 40×40×0.25 mm & K5-PRO 20g set
Synergistic bundle: PTM7950 by CSGR® phase change pad for CPU/GPU heat spreaders plus K5-PRO high viscosity thermal putty for VRAM/VRM and frame contact. DIY friendly, non conductive, fills up to 3 mm (≈1 mm optimal) and stabilizes thin or uneven heat sinks.
19,99 € -
PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
SET OF PRODUCTS & THERMAL PASTES24,99 €PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
Dual material cooling kit that pairs a phase change pad for CPU/GPU dies with a soft, lightly tacky 12.8 W/m·K* thermal putty for GDDR6 VRAM and power stages; DIY friendly, optimized around 0.25 mm and 1–2 mm bond lines.
24,99 € -
10,99 €
PTM7950 by CSGR® 40×40×0.25 mm phase change thermal pad for CPUs/GPUs; 8.5 W/m·K*
High performance phase change pad (melts near 45°C) that wets surfaces, fills micro gaps, and resolidifies for stable contact; electrically non conductive; ideal with modern GDDR6 VRAM, chipsets, and compact heat spreaders.
10,99 € -
PTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
SET OF PRODUCTS & THERMAL PASTES42,99 €PTM7950 by CSGR® 40x40x0.25 mm + UPSIREN UX PRO Ultra 20g set for GPUs/PS5 and water cooling
Phase change pad (8.5 W/m·K*) plus high viscosity putty (16.8 W/m·K*) to restore full contact in 2–4 mm gaps—ideal for water cooling cold plates, desktop GPUs, and PlayStation 5 assemblies.
42,99 € -
K4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTES5,99 €K4-PRO 10g applicator tube – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Apply and forget, non conductive silicone paste that wets micro gaps and stays stable; designed for business PCs, terminals, kiosks, fanless devices and industrial electronics where routine reopening isn’t planned.
5,99 € -
K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
THERMAL PASTES64,99 €K4-PRO 500g jar – low viscosity silicone thermal paste for long life systems; >4.6 W/m·K*
Bulk workshop jar for production and fleet service; apply and forget, non conductive paste that spreads thin, fills micro gaps and stays stable up to 220 °C in industrial, commercial and fanless platforms.
64,99 € -
KRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
THERMAL PASTES14,99 €KRYO33 3g applicator tube – High performance non conductive thermal paste; >13 W/m·K*
Premium CPU/GPU compound with >13 W/m·K* conductivity and ultralow thermal resistance (<0.004 K/W); zero electrical conductivity; no curing time; engineered to spread thin, fill micro gaps and deliver durable, long term stability.
14,99 € -
K5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTY19,99 €K5-PRO 20g (2×10g twist up tubes) + K4-PRO 7g applicator – thermal putty & paste set
Complete thermal service in one set: K5-PRO putty (>5.3 W/m·K*) for pad replacement and gap filling up to ~3 mm, plus K4-PRO silicone paste (>4.6 W/m·K*) for CPU/GPU dies—clean results for DIY and professional benches.
19,99 € -
K5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTY16,99 €K5-PRO 20g jar + K4-PRO 10g applicator – complete thermal putty & paste service set
Shop ready pairing: K5-PRO putty (>5.3 W/m·K*) to replace soft pads and fill up to ~3 mm gaps, plus K4-PRO silicone paste (>4.6 W/m·K*) for a longlife die interface—organized, repeatable results on common repairs.
16,99 € -
Tech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
SET OF PRODUCTS & SOLDERING FLUX & THERMAL PASTES & THERMAL PUTTY24,99 €Tech Essentials KIT – K5-PRO 10g + KRYO33 3g + CS-FLUX 5g DIY thermal & soldering set
Three-piece repair set for laptops, desktops and consoles: non conductive thermal putty (>5.3 W/m·K*), high performance thermal paste (>13 W/m·K*), and lead-free, halogen-free no-clean flux for precise SMD work.
24,99 € -
Ultimate Repaste KIT – K5-PRO 10g thermal putty + KRYO33 3g high performance paste
SET OF PRODUCTS & THERMAL PASTES & THERMAL PUTTY18,99 €Ultimate Repaste KIT – K5-PRO 10g thermal putty + KRYO33 3g high performance paste
Two part CPU/GPU service set for mixed interfaces: KRYO33 >13 W/m·K* on the die, K5-PRO >5.3 W/m·K* for pad replacement zones up to ~3 mm; non conductive, zero curing time, DIY friendly workflow.
18,99 € -
CS-FLUX 5g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
SOLDERING FLUX10,99 €CS-FLUX 5g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for visual alignment. Supports BGA rework when needed, while excelling in everyday SMD microsoldering—connectors, QFN/DFN, jumpers, and fine-pitch pads—with precise, low-pressure dosing.
10,99 € -
CS-FLUX 10g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
SOLDERING FLUX15,99 €CS-FLUX 10g – halogen-free, lead-free no-clean flux for SMD microsoldering, transparent when heated
Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for alignment and inspection. Everyday SMD tasks—ports, headers, jumpers, QFN/DFN—plus BGA rework when required; precise, low-pressure dosing from the included tip.
15,99 € -
17,99 €
CS-FLUX 10g (2x5g) – halogen-free, lead-free no-clean flux for SMD microsoldering
Two 5 g applicator tubes for flexible bench use; liquefies under heat and turns clear for visual alignment. Ideal for everyday SMD work—connectors, headers, QFN/DFN, jumpers—and supports BGA rework when needed.
17,99 € -
24,99 €
CS-FLUX 15g (3x5g) – halogen-free, lead-free no-clean flux for SMD microsoldering
Three 5 g applicator tubes for busy benches and field work; liquefies under heat, turns clear for inspection. Everyday SMD tasks—connectors, jumpers, QFN/DFN, headers—and BGA rework support when required.
24,99 € -
UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY39,99 €UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
39,99 € -
UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY74,99 €UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
74,99 € -
UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTY129,99 €UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
129,99 € -
UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky; ideal layer thickness ~1–2 mm for GDDR6 VRAMs, VRM stages, and controller chips in gaming laptops and slim consoles.
15,99 € -
UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky thermal putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hot VRM stages, display/I/O controller chips; easy for beginners to apply.
15,99 € -
UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY19,99 €UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs, VRM stages and controller chips; easy for amateur users to apply cleanly.
19,99 € -
UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTY39,99 €UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
39,99 € -
UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTY69,99 €UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
69,99 € -
K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTY10,99 €K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Lipstick-style twist-up tube for clean, tool free dosing in tight spaces; solves >90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
10,99 € -
11,99 €
K5-PRO 10g applicator tube (syringe style) – DIY thermal putty for pad replacement
Precise, low pressure dosing from a syringe style applicator tube; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
11,99 € -
K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTY12,99 €K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Shapeable, high viscosity putty solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C; ideal for VRAM/VRM and heat bridging to housings.
12,99 € -
K5-PRO® Mt. Olympos Edition 33g UV reactive thermal putty for pad replacement; >15 W/m·K*
THERMAL PUTTY36,00 €K5-PRO® Mt. Olympos Edition 33g UV reactive thermal putty for pad replacement; >15 W/m·K*
Premium non conductive thermal putty developed in Greece; ideal for GDDR6 and GDDR7 (DDR7) VRAM on next gen GPUs and compact systems. UV reactive for instant coverage verification; stable from −80 °C to 170 °C; DIY friendly, service grade results.
36,00 € -
K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
THERMAL PUTTY20,99 €K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
Three lipstick-style twist-up tubes for multi station benches and travel kits; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
20,99 € -
K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
THERMAL PUTTY30,99 €K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
Three 20 g jars for active benches and parallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C.
30,99 € -
K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
THERMAL PUTTY35,99 €K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
Six lipstick-style twist-up tubes for training, classrooms, and parallel benches; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
35,99 € -
K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
THERMAL PUTTY49,99 €K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
Large workshop jar for extended service; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; reliable for VRAM/VRM and heat bridging projects.
49,99 € -
K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
THERMAL PUTTY129,99 €K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
High volume 400 g jar for labs and refurbishers; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; decant for microscope work.
129,99 € -
BGA COAT Underfill Kit (50 ml Binder A + 25 g Filler B) – non epoxy, thermal, pro use
BGA CONSUMABLES24,99 €BGA COAT Underfill Kit (50 ml Binder A + 25 g Filler B) – non epoxy, thermal, pro use
Room temperature curing underfill that reinforces BGA packages, coats solder balls, and helps equalize heat; non epoxy and nontoxic; stable up to 250°C; designed for reball/reflow repair work flows in professional workshops.
24,99 € -
Diagnostics for Seagate (DfS) USB toolkit
Graphical head/sector diagnostics with perhead read speed/seek tests, translator/G-List tools, adjustable adapter voltage and auto architecture detection; Windows XP/7/8/10; compatible with Seagate SATA HDDs and select Maxtor units produced by Seagate.
119,99 € -
FileChecker by CS – Post recovery file quality checker software, 1PC full license (download)
DATA RECOVERY TOOLS29,99 €FileChecker by CS – Post recovery file quality checker software, 1PC full license (download)
Automates validation of recovered data by scanning headers, locating bad sector gaps, and applying perextension rules. Marks, renames, deletes or reports damaged files, runs unattended, and generates clear, exportable reports.
29,99 € -
FW-FXR kit – compatible with Seagate 7200.11/12 & Maxtor DiamondMax; fixes BSY and 0 MB
DATA RECOVERY TOOLS69,99 €FW-FXR kit – compatible with Seagate 7200.11/12 & Maxtor DiamondMax; fixes BSY and 0 MB
Complete USB repair kit with software, accessories, and a clear step by step manual—designed to help even users with limited experience resolve BSY and 0 MB (0 LBA) faults on compatible SATA hard drives. Videos available on YouTube: computersystemsgr.
69,99 € -
CSGR Data Recovery Tools Set – FW-FXR, DfS & FileChecker; Seagate SATA compatible
DATA RECOVERY TOOLS & SET OF PRODUCTS149,99 €CSGR Data Recovery Tools Set – FW-FXR, DfS & FileChecker; Seagate SATA compatible
Three complementary tools for firmware repair, diagnosis and post recovery file validation. Includes USB adapters, masks, software and FileChecker license; designed for use with Seagate SATA hard drives.
149,99 €