Three 5 g applicator tubes for busy benches and field work; liquefies under heat, turns clear for inspection. Everyday SMD tasks—connectors, jumpers, QFN/DFN, headers—and BGA rework support when required.
Three stations ready—one recipe for neat joints.
CS FLUX 15g (3x5g) is a halogen-free, lead-free, no-clean (meaning that any remaining CS-FLUX will not be corrosive to the PCB and does not need to be cleaned) flux packaged as three compact 5 g applicator tubes for teams, parallel benches, or spares. The gel places precisely at room temperature, then transitions to an ultra fluid state under heat, wicking under components and turning transparent so you can verify alignment, wetting, and fillet formation under magnification. It’s tailored for everyday microsoldering work—USB-C or HDMI connector swaps, drag soldering header rows, reattaching fine-pitch controllers, laying jumpers across damaged traces, and rejuvenating oxidized pads on tight logic boards—while also supporting BGA rework techniques when needed. CS-FLUX is formulated as a soft gel at room temperature, making it easy to dispense directly from the applicator tube without special tools. The user can apply the exact quantity needed with simple finger pressure, ensuring precision and control in every application. In contrast, many other fluxes are so thick that they require dedicated equipment such as pneumatic pumps to be squeezed out, making CS-FLUX a far more practical and user-friendly choice for both professionals and DIY users. The gentle tack helps hold small parts before heat; residues are low and wipe easily if an inspection clean finish is specified. Store sealed, protected from heat and sunlight; for long term stability, keep in a cool, dry place.
Packet includes:
• 3 × 5 g applicator tubes of CS-FLUX
• 3 × 1.6 mm precision application tips
Engineered in Greece, trusted across the EU.
• Becomes transparent at working temperature to keep pads, leads, and solder flow visible throughout the operation; confirm alignment and spot bridges early during microscope guided work.
• Uniform wicking beneath components when hot helps activate every pad evenly, enabling smooth drag solder passes on dense connectors and repeatable placement of QFN/DFN and other fine-pitch devices.
• Balanced gel tack for prestaging tiny parts and jumper wires; once heated, viscosity drops to reduce part drift, maintain stencil and array pattern integrity, and improve overall pass consistency.
• no-clean, halogen-free, lead-free chemistry leaves minimal, localized residues; when required for inspection or conformal coating, residues remove easily with high purity isopropyl alcohol.
• Three 5 g tubes with three precision tips support team work flows, separate ESD areas, and field kits; keep one tube dedicated for microscope only work and others for general rework.
• Works across iron-only touch ups, hot air, and IR plate processes; suited to connector and jack replacement, micro module rework, pad refresh operations, and other compact device repairs.
Additional information
Weight
80 g
Q: What is CS FLUX and what makes it different from other fluxes?
A: CS FLUX is a halogen free, lead free, no clean soft gel flux formulated for electronics repair and microsoldering. At room temperature it behaves like a controllable gel; under heat it becomes very fluid and turns transparent so you can see pads and solder flow clearly. Unlike thick pastes that need pumps or heavy pressure, CS FLUX dispenses with light finger pressure directly from the applicator tube.
Q: Do I need a pump or pneumatic dispenser?
A: No. The soft gel body is tuned for low pressure, hand controlled dosing. Squeeze gently and it will place a precise micro drop where you need it—ideal for microscopes and tight clearances.
Q: How fine is the dosing—can I place a single tiny drop?
A: Yes. The included precision needle tip allows very small, repeatable drops. Because the gel is soft, it starts and stops cleanly without “stringing,” so you can wick just enough under a connector pad or QFN edge.
Q: What does “no clean” mean here? Do I ever need to clean it?
A: No clean means the residues are non corrosive and safe to leave in typical electronics repairs. If you need a cosmetically clean board, plan to apply conformal coating, or you simply prefer a spotless finish, wipe with high purity isopropyl alcohol after the joint cools.
Q: Will CS FLUX corrode copper, solder mask, or components over time?
A: No. It’s halogen free and formulated to avoid corrosive residues. It is designed for modern PCB finishes and components when used as directed.
Q: Is it suitable for beginners?
A: Yes. The transparency when hot, low effort dosing, and soft pre heat tack make it very forgiving. Many first time users report cleaner joints with fewer bridges on USB C/HDMI connectors, headers, and fine pitch ICs.
Q: Can I use it for BGA work as well as everyday SMD?
A: Yes. It supports BGA rework and reballing (wicking under the package during heat), but its biggest day to day advantage is on connectors, QFN/DFN, jumpers, and small modules.
Q: Does it smoke a lot?
A: CS FLUX is low fume compared to many rosin heavy formulas. You’ll still see some vapor as with any flux—work in a ventilated area or use a fume extractor for comfort.
Q: Is it electrically conductive?
A: No. CS FLUX is non conductive. Like any flux, avoid leaving excessive residue where insulation resistance is critical, and clean if your application requires it.
Q: Leaded or lead free solder—does it matter?
A: It works with both. The activation profile is designed for common repair alloys (SnPb and SAC).
Q: Can I use it with a soldering iron, hot air station, or IR plate?
A: Yes. It is compatible with iron only touch ups, hot air rework, and IR preheating/reflow setups.
Q: How much should I apply?
A: Less than you think. Start with a micro drop; as heat is applied the flux turns very fluid and spreads, activating the entire pad. Add more only if you see dull, stubborn wetting.
Q: Will parts slide around when I heat them?
A: The gel has a light tack at room temperature to help “stage” parts. As it liquefies, part drift is minimized by using just enough flux and maintaining even heat.
Q: Tips for USB C/HDMI/DC jack replacements?
A: Place a small line along the pad row, align, and heat evenly. The flux will wick under the footprint and turn clear so you can watch bridges form and collapse. After soldering, inspect and clean only if you want an appearance grade finish.
Q: Can it help with oxidized pads?
A: Yes. A small amount brushed across dull pads improves wetting before you tin or drag solder.
Q: How do I remove residues if I choose to clean?
A: After the board cools, wipe with high purity isopropyl alcohol and a lint free swab. For heavy areas, a brief soak and gentle brushing works well.
Q: Storage and longevity—what’s recommended?
A: Keep the cap on, store sealed in a cool, dry place, away from heat and sunlight. If it has been stored cold, let it return to room temperature before use for consistent viscosity.
Q: The gel seems thicker after storage—what should I do?
A: Allow it to warm to room temperature and knead the tube lightly before attaching the tip. Replace or rinse the tip if it has dried residues.
Q: Will it stain plastics or the solder mask?
A: Residues are usually thin and clear. Avoid prolonged soaking of porous plastics or elastomers; wipe any excess soon after work for best cosmetics.
Q: Can I use CS FLUX on large ground planes or heavy copper boards?
A: Yes, but preheating the board (hot plate or gentle hot air preheat) reduces thermal shock and improves flow on high mass areas.
Q: Is it safe around sensitive sensors or cameras on phones/tablets?
A: Use sparingly and shield optics from vapors while heating. The transparent behavior helps you keep flux away from lenses and membranes.
Q: Does it help with drag soldering pin headers and fine pitch ICs?
A: Absolutely. Place a micro bead along the pins and use a clean, tinned iron tip; the flux promotes even wetting so excess solder follows the tip instead of bridging.
Q: Can I reuse the precision tip?
A: Yes. Cap the tube between sessions. If the tip clogs, rinse with isopropyl alcohol, let dry, and reinstall. Keep a spare clean tip for microscope work.
Q: What quantities are available and what comes in the pack?
A: CS FLUX is available in single 5 g and 10 g tubes, dual 5 g (2×5 g), and triple 5 g (3×5 g) packs. Each tube includes a precision application tip. All packs are ready to use—no pump or extra hardware required.
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Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for visual alignment. Supports BGA rework when needed, while excelling in everyday SMD microsoldering—connectors, QFN/DFN, jumpers, and fine-pitch pads—with precise, low-pressure dosing.
Low viscosity gel that liquefies under heat and wicks beneath components, turning clear for alignment and inspection. Everyday SMD tasks—ports, headers, jumpers, QFN/DFN—plus BGA rework when required; precise, low-pressure dosing from the included tip.
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