Description

Coat, reinforce, and even the heat—no epoxy.
BGA COAT is a professional underfill/coating system designed to strengthen BGA components after reballing or reflow and to protect the solder ball array from environmental stress. Once applied, it forms an interconnection between the BGA package and the PCB and creates a protective perimeter coating around the balls, reducing the chance of joint fracture after shock or vibration and limiting oxidation and tin whisker growth. It also offers good thermal conductivity*, helping to equalize temperature at the base of the package and, where design allows, assist heat flow toward the system heat sink. Non epoxy and nontoxic, it is intended for use by trained technicians.
Mix Binder A with Filler B at a 2:1 ratio, apply around the BGA/PCB gap, and allow a full room temperature cure (approximately 48 hours). Do not power the board until curing is complete. Tools can be wiped clean before the mixture sets; after hardening, removal is only by mechanical means. The cured material maintains form up to 250°C.

Packet includes:
• 2 × 25 ml Binder A (50 ml total)
• 1 × 25 g Filler B
• 1 × dispenser with ml markings
• 1 × application spatula
• 1 × storage box

The kit yields roughly 70 ml of mixed BGA COAT—enough for many jobs, as typical BGAs require about 0.5 ml. Designed for professional workshops that need an underfill available in practical quantities rather than industrial only packaging.

Not a cream. A tool.

*Computer Systems Materials Science Laboratory testing (comparative technique; P. Karydopoulos, P. Frantzis, N. Karagiannis; MSAIJ, 2014).

• Structural reinforcement for repairs: forms a perimeter underfill that bonds the package to the PCB and coats the solder ball field, reducing the risk of joint fracture after handling, transport, or drop events while limiting oxidation and whisker growth.
• Thermal assistance where it matters: the cured material exhibits good thermal conductivity*, helping to even out localized hot spots at the base of the BGA and supporting heat flow toward the device’s cooling path when design permits.
• Professional grade formulation: non epoxy and nontoxic for workshop use; supplied in quantities suitable for small labs and repair centers rather than industrial bulk only.
• Practical curing workflow: room temperature cure in about 48 hours; keep boards unpowered during cure; cured material withstands up to 250°C, aligning with common rework temperature envelopes.
• Efficient coverage and yield: kit produces roughly 70 ml mixed volume—enough for many repairs since most BGAs consume about 0.5 ml—supporting repeatable, cost effective service.
• Complete toolkit in the box: measured dispenser, spatula, and storage container accompany Binder A and Filler B so technicians can mix accurately and apply cleanly without sourcing extra accessories.

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