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UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY39,99 €UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
39,99 € -
UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY74,99 €UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
74,99 € -
UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTY129,99 €UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
129,99 €