Showing all 6 results
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PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
SET OF PRODUCTS & THERMAL PASTES24,99 €PTM7950 by CSGR® 40×40×0.25 mm + UPSIREN U6 PRO® 20g set – phase change pad and thermal putty kit
Dual material cooling kit that pairs a phase change pad for CPU/GPU dies with a soft, lightly tacky 12.8 W/m·K* thermal putty for GDDR6 VRAM and power stages; DIY friendly, optimized around 0.25 mm and 1–2 mm bond lines.
24,99 € -
UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky; ideal layer thickness ~1–2 mm for GDDR6 VRAMs, VRM stages, and controller chips in gaming laptops and slim consoles.
15,99 € -
UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky thermal putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hot VRM stages, display/I/O controller chips; easy for beginners to apply.
15,99 € -
UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY19,99 €UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs, VRM stages and controller chips; easy for amateur users to apply cleanly.
19,99 € -
UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTY39,99 €UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
39,99 € -
UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTY69,99 €UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
69,99 €