Showing all 18 results
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PTM7950 by CSGR® 40×40×0.25 mm & K5-PRO 20g set
Synergistic bundle: PTM7950 by CSGR® phase change pad for CPU/GPU heat spreaders plus K5-PRO high viscosity thermal putty for VRAM/VRM and frame contact. DIY friendly, non conductive, fills up to 3 mm (≈1 mm optimal) and stabilizes thin or uneven heat sinks.
19,99 € -
UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY39,99 €UPSIREN UX PRO Ultra 20g jar – Max conductivity non conductive thermal putty for 2–4 mm gaps
High viscosity, hand moldable compound for water cooling cold plates, desktop GPUs and consoles like PS5; 16.8 W/m·K*; forms a stable 2–4 mm interface where ordinary paste cannot maintain contact.
39,99 € -
UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
THERMAL PUTTY74,99 €UPSIREN UX PRO Ultra 50g jar – high viscosity non conductive thermal putty for 2–4 mm gaps
Hand moldable compound for water cooling plates, desktop GPUs and consoles; 16.8 W/m·K*; maintains a stable interface where standard paste cannot bridge tolerances.
74,99 € -
UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
THERMAL PUTTY129,99 €UPSIREN UX PRO Ultra 100g jar – Bulk max conductivity non conductive thermal putty for 2
High viscosity, hand moldable compound for water cooling plates, desktop GPUs and high power consoles; 16.8 W/m·K*; engineered for wide tolerances where paste can’t maintain contact.
129,99 € -
UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g applicator tube – Precision thermal putty for thin heat sinks;12.8 W/m·K*
Applicator tube format for clean, drop by drop placement in tight layouts; soft and lightly tacky; ideal layer thickness ~1–2 mm for GDDR6 VRAMs, VRM stages, and controller chips in gaming laptops and slim consoles.
15,99 € -
UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY15,99 €UPSIREN U6 PRO 10g jar – Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky thermal putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm for tight, thin heat sinks; targets GDDR6 VRAMs, hot VRM stages, display/I/O controller chips; easy for beginners to apply.
15,99 € -
UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
THERMAL PUTTY19,99 €UPSIREN U6 PRO 20g jar –Thermal putty for thin heat sinks in gaming laptops and slim consoles
Soft, lightly tacky putty that levels mixed heights and stays in place; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs, VRM stages and controller chips; easy for amateur users to apply cleanly.
19,99 € -
UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
THERMAL PUTTY39,99 €UPSIREN U6 PRO 50g jar – Thermal putty for thin heat sinks in gaming laptops and compact systems
Soft, lightly tacky compound for tight layouts; ideal layer thickness ~1–2 mm; targets GDDR6 VRAMs and VRM stages; easy for beginners; workshop capacity for repeated services.
39,99 € -
UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
THERMAL PUTTY69,99 €UPSIREN U6 PRO 100g jar – High capacity thermal putty for thin heat sinks; 12.8 W/m·K*; non conductive
Soft, lightly tacky compound optimized for ~1–2 mm layers on GDDR6 VRAMs, VRM stages and controller chips; designed for gaming laptops and compact systems; easy, clean application for all skill levels.
69,99 € -
K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTY10,99 €K5-PRO 10g twist up tube – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Lipstick-style twist-up tube for clean, tool free dosing in tight spaces; solves >90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
10,99 € -
11,99 €
K5-PRO 10g applicator tube (syringe style) – DIY thermal putty for pad replacement
Precise, low pressure dosing from a syringe style applicator tube; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C.
11,99 € -
K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
THERMAL PUTTY12,99 €K5-PRO 20g jar – DIY thermal putty for pad replacement; non conductive, trusted since 2013
Shapeable, high viscosity putty solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); >5.3 W/m·K*; stable from −90 °C to 250 °C; ideal for VRAM/VRM and heat bridging to housings.
12,99 € -
K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
THERMAL PUTTY20,99 €K5-PRO 3x10g twist up tubes – DIY thermal putty multipack; non conductive, widely used since 2013
Three lipstick-style twist-up tubes for multi station benches and travel kits; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
20,99 € -
K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
THERMAL PUTTY30,99 €K5-PRO 3x20g jars – DIY thermal putty shop pack; non conductive; >5.3 W/m·K*; trusted since 2013
Three 20 g jars for active benches and parallel work flows; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C.
30,99 € -
K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
THERMAL PUTTY35,99 €K5-PRO 6x10g twist up tubes – DIY thermal putty team pack; non conductive, trusted since 2013
Six lipstick-style twist-up tubes for training, classrooms, and parallel benches; solves >90% of pad replacement cases; fills to 3 mm (≈1 mm optimal); >5.3 W/m·K* within −90 °C to 250 °C.
35,99 € -
K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
THERMAL PUTTY49,99 €K5-PRO 110g jar – DIY thermal putty for pad replacement; non conductive;>5.3 W/m·K*; trusted since 2013
Large workshop jar for extended service; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; reliable for VRAM/VRM and heat bridging projects.
49,99 € -
K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
THERMAL PUTTY129,99 €K5-PRO 400g jar – DIY thermal putty bulk supply for workshops; non conductive;>5.3 W/m·K*
High volume 400 g jar for labs and refurbishers; solves over 90% of pad replacement cases; fills up to 3 mm (≈1 mm optimal); stable from −90 °C to 250 °C; decant for microscope work.
129,99 €