Showing the single result
-
BGA COAT Underfill Kit (50 ml Binder A + 25 g Filler B) – non epoxy, thermal, pro use
BGA CONSUMABLES24,99 €BGA COAT Underfill Kit (50 ml Binder A + 25 g Filler B) – non epoxy, thermal, pro use
Room temperature curing underfill that reinforces BGA packages, coats solder balls, and helps equalize heat; non epoxy and nontoxic; stable up to 250°C; designed for reball/reflow repair work flows in professional workshops.
24,99 €